The future of high temperature interconnect



Microsemi Semiconductor Ltd (formally Zarlink Semiconductor Ltd) is a multi national semiconductor company headquartered in the US. At the facility in Portskewett Monmouthshire, the team design, develop and manufacture advanced microelectronic technologies, miniaturisation, low power wireless communication, energy harvesting and high ambient temperature electronics. The site has extensive micro-packaging capabilities for medical, wireless, telecommunications and security customers.

Microsemi is a leading “system in package” component supplier to the electronics industry and has a proven track record in implementing new concepts developed under the FP6/7 umbrella and TSB funded collaborations.

Microsemi (as Zarlink) first joined the collaborative projects in 2003. Since then Microsemi has been involved with 7 EU projects and 5 TSB as well as managing projects using its integral industrial expertise and systems up to the value of €10M.

With over 20 years experience in micro-electronics assembly, focusing on miniaturisation through SIP packaging Microsemi is are well placed to understand the potential for new innovative product. For the past 4 years Microsemi (Zarlink) has been developing and qualifying high temperature packaging for product operating at 225oC ambient. Microsemi is currently the project coordinator for the €4M EU funded SOI-HITs project on 225 oC sensors.


In stage 1 of the proposal the legal name of the lead partner was given as Zarlink Semiconductor Ltd. Following the acquisition of Zarlink Corporation by Microsemi Corp and subsequent re-branding the legal name of Zarlink in the UK has changed to Microsemi Semiconductor Ltd. All other details remain unchanged.


Piers Tremlett has over 20 years experience working in the development of new packaging processes and designs within Microsemi’s Advanced Packaging Business and previously with Lucas Automotive, Sensors and Controls. He holds a BSc in Metallurgy & Material Science and an MSc in Management, Manufacturing &Technology. He is MSL’s senior specialist on the subject of microelectronics and is supporting Microsemi’s strategy to deliver the next generation of organic/pcb based high temperature electronics. Microsemi have been investing in his research on high temperature electronics for the past 4 years. Previous high temperature projects include SOI-HITS, a €2 million European Union project, which delivered a prototype organic pcb assembly system for a gas sensor that survived for more than 2000 hours at 250C.

Jo Postle
Jo graduated from University of South Wales in 2014 gaining an MBA specialising in business improvement and creativity to support her extensive work based experience. Jo has over 15 years’ experience in project management and business improvement within the service and manufacturing industries. Jo is the Business Improvement Project Lead at Microsemi and has worked for the organisation for 5 years developing robust and efficient processes for continued business improvement activities. Jo has worked on and managed various EU and UK grant funded projects including Framework 7, Horizon 2020 and Innovate UK.

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